• Layers: 1-12

•  Max. Board Size: 20" x 24"

•  Board Thickness: 0.3-3mm

•  Min. Line Width: 0.1mm

• Min. Line Space: 0.1mm

• Min. Via Hole Size: 0.2 mm

• Min. Buried Hole Size: 0.2mm

• Min. blind Hole Size: 0.1mm

• PHT wall thickness: ≥0.025mm

• Hole Position Tolerance: +/-0.05mm

• Insulation Resistance: 10¹² Ohms

• Dielectric Strength: >1.3KV/mm

• Current Breakdown: 10A

• Surface Finish: Ni/Au plated, Silkscreen, Carbon ink, HAL anti-oxidize

• PCB Material: FR-4, FR-3, FR-2, FR-1, CEM-1, CEM-3