Laser Scribe/Cutting on Ceramic Substrates
High precision laser scribe/cutting and drilling on ceramic substrates are available.
Ceramic Substrates:
• 96% Al2O3: Thick Film Hybrid Circuit, Resistors, Thermal Electric/Power Modules
• 99.6% Al2O3 : Thick Film Circuits, Power Hybrid Circuits
• Aluminum Nitride : Thick Film Hybrid, High Density Electronic Packages, Power Modules
• 95% Al2O3 : Engineering structural applications and wear/corrosion resistant applications
High Precision Laser Process:
• Lengths and widths up to 7½" x 5 ½"
• Thickness Tolerance: +/-0.05mm
• Scribing Width: ≥ 0.10mm
• Hole Diameter: ≥ 0.20mm
• Hold Diameter Tolerance: +/-0.08mm for hole up to 2.0mm
• Tolerance between holes: +/-0.05mm
